Group wiki / Cleanroom processes

Standard photolithography

AZ5214 as positive and image-reversal resist, and SU-8 3005 with an Omnicoat release layer.

By Zihuan Liu · Last checked Dec 2023 · Migrated

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Expired photoresist is still usable, but it gets more viscous, so spun films come out thicker than the datasheet says.

AZ5214 as a positive resist

Reference: AZ 5200 series datasheet.

Step Setting Notes
1. Clean Piranha or AMI clean Choose based on what is already on the wafer.
2. HMDS prime (optional) 2 min prime, about 18 min 20 s total cycle Recommended for small features. Improves adhesion so the resist survives dicing.
3. Spin 3000 rpm, 30 s About 1.6 µm of AZ5214.
4. Pre-bake 110 °C, 50 s, hotplate Check the hotplate temperature first.
5. Expose (MA8) 75–100 mJ/cm² Recipe files are in the “Zihuan Liu” folder on the tool.
6. Develop AZ400K : water = 1 : 4 (50 ml : 200 ml), 25–35 s Adjust time until the pattern is clearly visible.

AZ5214 as an image-reversal (negative) resist

Follow steps 1 to 5 above, then:

  1. Reversal bake: after exposure and before developing, bake at 110–120 °C for 45 s.
  2. Flood expose: more than 300 mJ. The exact dose is not critical, just make it enough.
  3. Develop as in step 6 above.

SU-8 3005 as a negative resist

References: Kayaku Advanced Materials SU-8 3000 datasheet and Omnicoat datasheet.

Omnicoat release layer

Omnicoat lets you strip SU-8 cleanly later.

  • Spin at 1000 rpm for 40 s, then bake at 200 °C for 1 min.
  • Apply 3 coats (about 17 nm each, roughly 40 nm total). Let the wafer cool to room temperature between coats.

SU-8 process

Step 3 µm film 10 µm film Notes
1. Spin 4000 rpm, 40 s 1000 rpm, 40 s  
2. Soft bake, 95 °C 3 min 6 min  
3. Expose (MA8) 100–200 mJ/cm² 100–200 mJ/cm² Pattern is not visible yet. Recipes in the “Zihuan Liu” folder.
4. Post-exposure bake 95 °C, 3 min 95 °C, 3 min Pattern appears after this step.
5. Develop SU-8 developer, 1 min same  
6. Rinse and dry IPA, then N₂ gun same Use IPA, not DI water.
7. Remove exposed Omnicoat Oxford RIE, recipe “YS Omniremoval” same 90 s is enough for 3 coats; the saved recipe runs 4 min.

Stack summary: Omnicoat on Al₂O₃ → SU-8 on Omnicoat → PEB → develop → RIE to clear the Omnicoat. See Oxford 80 RIE.


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